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Author
:
Joshua Depiver
Publications
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
Joshua Depiver
,
Sabuj Mallik
,
Yiling Lu
and
Emeka Amalu
EasyChair Preprint 5719
Keyphrases
Creep
,
Fatigue
,
Isothermal ageing
,
strain
,
stress
,
thermal cycling
.
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