As the 11^th edition of the series launched in 2013, ICMSSM 2026 focuses on the design and analysis of mechanical structures with smart materials. A globally renowned academic event, it covers key areas like adaptive structural design, smart materials for sensing/monitoring, energy harvesting, vibration control, and biomechanics.

Amid global surging demand for smart materials, research in this field grows more critical. ICMSSM 2026 builds on past successes—prior conferences were held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi’an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; Bangkok, Thailand (virtual) in 2023; Beijing, China in 2024; and Bangkok, Thailand in 2025. It acts as a key platform for global academics and practitioners to exchange smart materials integration insights, aiming to develop more efficient systems and drive engineering and materials science forward.

List of Topics

• Topic 1 : Smart Materials and Surfaces
• Topic 2: Mechanical Science and Technology Advances
• Topic 3: Smart Structures and Systems
• Topic 4: Materials Manufacturing and Processing
• Topic 5: Methodology of Research and Analysis and Modeling

Publication

Papers submitted to MEACM 2025 will be reviewed by technical committees of the conference. All papers accepted and successfully registered will be featured in the IOP Conference Series: Journal of Physics (JPCS) 【Online ISSN: 1742-6596】. And the press will submit all papers to major databases such as EI Compendex, Scopus and Scholar...  

Contact

All papers should be submitted using the submission system provided by Openconf system or Email. Please choose a way to submit, do not repeat the submission.

1. OpenConf Submission: https://www.icmssm.org/openconf/openconf.php

2. Email submission: cfp@icmssm.org

Contact Us：

Email: cfp@icmssm.org

Wechat: 13125407442

Web: https://www.icmssm.org/